Electronics Assembly


conformal_coating       led    keypadpotting

ADHESIVES, CONFORMAL COATINGS, ENCAPSULANTS AND RUGGEDISING MATERIALS FOR ELECTRONIC ASSEMBLY

Conformal Coatings Protect Circuit Boards from Service Environments

Coating Application Features
9481-E Thin, chemically resistant; Recommended where shadow is present and components cannot withstand heat cure Solvent free; fast light cure; secondary moisture cure over time; moisture cure provides room temperature cure for coating entrapped in shadowed areas; thin, rigid coating provides chemical and abrasion resistance; low odor; IPC-CC-830B approved; MIL-I-46058C listed; mitigates tin whiskers; halogen-Free; UL recognized
9482 Reworkable, chemically resistant; Recommended where shadow is present and components cannot withstand heat cure Solvent free; fast light cure; secondary moisture cure over time; moisture cure provides room temperature cure for coating entrapped in shadowed areas; engineered for coating thicknesses up to 0.254 mm (0.010 in); demonstrates excellent re-workability and thermal cycling properties; mitigates tin whiskers; halogen-free
984-LVUF Thin, chemically resistant conformal coating Solvent free; fast light cure; secondary heat cure; thin and rigid; provides chemical and abrasion resistance; isocyanate free; IPC-CC-830 approved; MIL-I-46058 listed; halogen-free; UL recognized
987 Thin, chemically resistant; recommended for difficult-to-wet components and assembly materials Solvent free; fast light cure; secondary heat cure; thin and rigid; chemical and abrasion resistance; lower surface energy provides enhanced wetting to components and assembly materials; isocyanate free; IPC-CC-830 approved and MIL-I-46058 listed; halogen-free
9-20351-UR Flexible; engineered thickness between 50 mic [0.002 in] and 0.51 mm [0.020 in], although it may be applied thinner Solvent free; fast light cure; Ultra-Red™ fluorescing; isocyanate free; suitable for some types of spray equipment secondary heat cure; low VOC; high viscosity for selective application of thick coating optimized for wetting high profile leads; low modulus allows it to excel in thick coating applications where thermal shock performance is critical; halogen-free
9-20557 Medium thickness, flexible Solvent free; fast light cure; secondary heat cure; medium viscosity; enhances coverage of leads and components; low modulus for thermal excursions enhances thermal shock performance; isocyanate free; IPC-CC-830 approved; MIL-I-46058 listed and UL recognized; halogen-free
9-20557-LV Thin, flexible Solvent free; fast light cure; secondary heat cure; low viscosity is compatible with most types of spray equipment; low modulus for thermal excursions enhances thermal shock performance; isocyanate free; IPC-CC-830 approved and MIL-I-46058 listed; halogen-free

 

Light Curing Encapsulants for Microelectronic Assembly Selector Guide

Encapsulant Applications Features
9001-E-v3.1 Chip-on-board; chip-on-flex; multi-chip modules; chip-on-glass; wire bonding; bare die encapsulation UV/Visible light cure for fastest processing; secondary heat cure for shadowed areas; multiple viscosities available for optimal coverage; one part, so no mixing is required; solvent free, Isocyanate free; low Tg, low modulus for wire bonding; halogen-free; LED light-curable
9008 Chip-on-flex encapsulation and flex circuit bonding/attachment Flexible; highly moisture-resistant bonds to diverse surfaces such as polyimide, DAP, glass, epoxy board, metal, and PET; high adhesion, even at -40°C; halogen-free
NEW! 9101 Chip-on-board; chip-on-flex; chip-on-glass; wire bonding UV/Visible light cure; secondary moisture cure; flexible encapsulant; shadowed area performance; moisture and thermal resistance; high CTE and low Tg for lower stress on components; halogen-free
NEW! 9102 Chip-on-board; chip-on-flex; chip-on-glass; wire bonding UV/Visible light cure; secondary moisture cure; flexible encapsulant; shadowed area performance; moisture and thermal resistance; high CTE and low Tg for lower stress on components; halogen-free
NEW! 9103 Chip on board; chip-on-flex; chip-on-glass; wire bonding UV/Visible light cure; secondary moisture cure; flexible encapsulant; shadowed area performance; moisture and thermal resistance; high CTE and low Tg for lower stress on components; halogen-free

 

Optical Display Bonding and Lamination Adhesives Selector Guide

LCD Optical Bonder Application Features
NEW! 9701 Optical display lamination and bonding of hand-held, touch, and large display LCD screens UV/Visible light cure; low viscosity performance; optically clear; non-yellowing; excellent re-workability; low shrinkage; good thermal shock resistance; bonds a variety of surfaces; halogen-free
NEW! 9702 Optical display lamination and bonding of hand-held, touch, and large display LCD screens UV/Visible light cure; medium viscosity performance; optically clear; excellent re-workability; non-yellowing; low shrinkage; bonds to a variety of surfaces; good thermal shock resistance; halogen-free
NEW! 9703 Edge damming; Optical display lamination and bonding of hand-held, touch, and large display LCD screens UV/Visible light cure; gel viscosity performance; excellent re-workability; non-yellowing; low shrinkage; bonds to a variety of surfaces; good thermal shock resistance; optically clear; halogen-free
9641-LV Optical bonding of touch screens, protective cover windows UV/Visible light cure; low/medium viscosity for pouring onto display surface; optimized cure speed and modulus for low-stress bond; enhanced resistance to yellowing from heat or UV exposure; optically clear; halogen-free
9-20737 Sealing frame to display surface UV/Visible light cure; one part, no mixing required; high viscosity for filling gap without flowing into shadowed areas; No VOCs; solvent resistant; adhesion to various substrates; halogen-free

 

Light-Curable Keypad Coatings Selector Guide

Keypad Coating Applications Features
9663 Keypad coating UV/Visible light cure in seconds; low outgassing; abrasion resistant; low viscosity for bubble-free dispensing

keypad-forming-process-diagram

 

Electronic Masking Materials Selector Guide

Maskant Applications Features
9-318-F Masking for conformal coating application; masking for wave solder or reflow processes Thixotropic for easy application on difficult-to-mask areas; fast UV/Visible light cure; peels easily and cleanly without leaving residue or contaminants on the surface of components or circuitry; fluoresces under black light for visual inspection; halogen-free
9-20479-B Masking for conformal coating application; masking for wave solder or reflow processes Extremely thixotropic for precise placement on difficult-to-mask areas; fast UV/Visible light cure; peels easily and cleanly without leaving residue or contaminants on the surface of components or circuitry; blue color for visual inspection; halogen-free

 

UV Light-Curable Potting Compounds Selector Guide

Potting Compound Applications Features
921 Series Component potting Urethane acrylate; light cure in seconds; secondary heat cure; one part, no mixing is required; multiple viscosities; visible light cure for maximum cure depth; adhesion to filled plastics including PBT/Valox®; halogen-free
9001-E-v3.1 Chip-on-board; chip-on-flex; multi-chip modules; chip-on-glass; wire bonding; bare die encapsulation Urethane acrylate; UV/Visible light cure for fastest processing; secondary heat cure for shadowed areas; optimal coverage; one part, so no mixing is required; solvent free, Isocyanate free; low Tg, low modulus for wire bonding; halogen-free; LED light-curable

 

Wire Tacking and Component Ruggedizing Adhesives Selector Guide

Adhesive Applications Features
9309-SC Reinforcing fine pitch or leadless components; underfill alternative; shock absorption Tack-free cure; compatible with both needle and jet dispensing equipment; adhesion to various PCB substrates; reduces stress on board components; highly thixotropic for minimal movement after dispense; See-Cure adhesives appear blue when dispensed and become clear for easy verification of cure; halogen-free
9422-SC Reinforcing fine pitch or leadless components; underfill replacement; staking Fast, room-temperature cure; adhesion to various PCB substrates; low modulus for reducing stress on board components; highly thixotropic for minimal movement after dispense; See-Cure adhesives appear blue when dispensed and become clear for easy verification of cure; halogen-free
9-911-REV-A Wire tacking/coil termination On-demand cure for optimal positioning; easily dispensed by hand; exposed areas cure in seconds for immediate strength; shadowed areas may cure with heat over time; halogen-free

 

LED Protection Encapsulants and Potting Materials Selector Guide

Potting Material/Encapsulant Application Features
9622 Instant casting of LEDs; LED die cast; colorless cavity molding; rapid forming of protective optical lens for high intensity LEDs High viscosity for dome shape; UV/Visible light cure for fastest processing; heat resistant to 100°C; low VOC; one part, no mixing required; resistant to long-term UV exposure; high light transmittance; durometer between silicone and epoxy; halogen-free

 

Thermal Interface Materials (TIM) Selector Guide

TIM Applications Features
9-20801 Thermal interface adhesive Thermally conductive; 0.9 W/m*K; UV/Visible light cure for exposed areas in seconds; activator or heat cure shadowed areas; one part; solvent free; halogen-free
501-E Activator Solvent-free activator; Low viscosity ideal for thin spray or brush applications