Electronics Assembly
ADHESIVES, CONFORMAL COATINGS, ENCAPSULANTS AND RUGGEDISING MATERIALS FOR ELECTRONIC ASSEMBLY
Conformal Coatings Protect Circuit Boards from Service Environments
| Model |
Key Feature |
Resources |
| 9-20557 |
- Secondary heat cure for shadowed areas
- Blue fluorescing
- Low VOCs
- One part, no mixing required
- Suitable for most types of spray equipment
- Medium viscosity, designed to enhance wetting of leads
- Low modulus for thermal cycling performance
- MIL-I-46058C, IPC-CC-830-B, UL recognized
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| 9451 |
- Secondary heat cure for shadowed areas
- True black conformal coating
- Uniform matte finish
- ULVO flammability
- Designed for thin coatings
- One-part coating – no mixing required
- Covers sensitive information
- Can be coated in multiple passes
- Optimized for single pass coating up to 0.004″
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| 9452-FC |
- Secondary heat cure
- LED curable
- Flammability (V0 internal)
- Blue fluorescing
- Very good thermal shock resistance
- Excellent wettability
- 100% solids
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| 9481-E |
- Secondary moisture cure for shadowed areas
- One part, no mixing required
- Bright blue fluorescing
- Low viscosity for thin coatings
- Chemically resistant
- Low VOC
- Low odor
- MIL-I-46058C, IPC-CC-830B, UL 94 V-0 & UL 746-E approved.
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| 9482 |
- Secondary moisture cure for shadowed areas
- Excellent thermal shock resistance
- One part, no mixing required
- Bright blue fluorescing
- Superior re-workability
- Chemically resistant
- Fast tack-free cure
- Low surface tension
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| 9483 |
- Secondary moisture cure for shadowed areas
- Excellent thermal shock resistance
- High-temperature flexibility
- Excellent chemical and corrosion resistance
- Good temperature/humidity (85/85) performance
- Solvent-free
- One part, no mixing required
- Bright blue fluorescing
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| 984-LVUF |
- Secondary heat cure for shadow areas
- Isocyanate free
- One part, no mixing required
- Low viscosity for thin coatings
- Rigid for chemical and abrasion resistance
- MIL-I-46058C listed
- IPC-CC-830-B approved
- UL recognized
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Peelable Maskant For Temporary Surface Protection
| Model |
Key Features |
Resources |
| 9-20479-B-Rev-A |
- Exceptionally thixotropic for manual or automated dispensing
- Compatible with gold and copper connector pins
- Silicone-free
- Masking for conformal coating applications
- Masking for wave solder or reflow processes
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| 9-318-F |
- Medium adhesion for peeling
- Masking for wave solder or reflow processes
- Masking for conformal coating applications
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| 9-7001 |
- Compatible with gold and copper connector pins
- Visible pink color in uncured state
- Resistance to solvent based conformal coatings and primers
- Fast curing
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Encapsulant For Printed Circuit Board Components
| Encapsulant |
Key Features |
Resources |
| 9-20558-Rev-A |
- Secondary heat cure
- Thixotropic
- High viscosity coating
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| 9001-E-V3.1 |
- LED light-curable
- Secondary heat cure for shadowed areas
- One part, no mixing is required
- Solvent free, Isocyanate free
- Low Tg, low modulus for wire bonding
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| 9008 |
- Low VOC
- Solvent free, Isocyanate free
- Thixotropic for precise dispensing on ICs
- Highly moisture resistant
- Low dielectric constant for high frequency applications
- Low modulus for minimal stress
- Remains flexible at low temperatures
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| 9037-F |
- Secondary heat cure
- Blue fluorescing
- Moisture and thermal resistance
- Thixotropic for precise dispensing
- Flexible
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| 9101 |
- Secondary moisture cure
- Flexible encapsulant
- Low VOC
- Solvent free, Isocyanate free
- Shadowed area performance
- Moisture and thermal resistance
- High CTE/low Tg for lower stress on components
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| 9102 |
- Secondary moisture cure
- Flexible encapsulant
- Low VOC
- Solvent free, Isocyanate free
- Shadowed area performance
- Moisture and thermal resistance
- High CTE/low Tg for lower stress on components
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| 9103 |
- Secondary moisture cure
- Flexible encapsulant
- Low VOC
- Solvent free, Isocyanate free
- Shadowed area performance
- Moisture and thermal resistance
- High CTE/low Tg for lower stress on components
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Wire Tacking & Component Corner Bonding
| Adhesive |
Key Features |
Resources |
| 9-911-Rev-B |
- Secondary Heat Cure
- High Viscosity for Optimal Coverage of Wires
- One Part, No Mixing Required
- Fast curing.
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| 9309-SC |
- Blue-to-clear upon exposure to UV/Visible light
- Reduces stress on board components
- Highly thixotropic
- Shock absorption
- Underfill alternative
- Reinforcing fine pitch components.
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| 9422-SC |
- Blue-to-clear upon exposure to UV/Visible light
- Reduces stress on board components
- Highly thixotropic
- Shock absorption
- Underfill alternative.
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